EODData

SHE, 002008: Han'S Laser Tech A

10 Aug 2026
LAST:

95.91

CHANGE:
 3.84
OPEN:
99.97
HIGH:
100.90
ASK:
0.00
VOLUME:
43.49M
CHG(%):
3.85
PREV:
99.75
LOW:
92.91
BID:
0.00
 

CHART

RECENT END OF DAY PRICES

DateOpenHighLowCloseVolume
10 Aug 2699.97100.9092.9195.9143.49M
07 Aug 2695.20101.1394.7599.7553.82M
06 Aug 2692.3098.0390.7595.2041.81M
05 Aug 2687.3795.7586.5094.8054.01M
04 Aug 2682.2989.3380.3288.2551.87M
03 Aug 2684.0186.4880.8081.2137.24M
31 Jul 2689.0090.0984.4884.5155.94M
30 Jul 2689.0890.7581.9081.9053.84M
29 Jul 2694.0796.0586.7391.0052.49M
28 Jul 26100.01102.5193.1194.1741.46M

PROFILE

Name:Han'S Laser Tech A
About:Han's Laser Technology Industry Group Co., Ltd., together with its subsidiaries, researches, develops, produces, and sells laser processing equipment in China and internationally. The company offers ultraviolet and ultrafast lasers, high power fiber lasers, medium and low-power CO2 lasers, and pulsed fiber lasers, as well as general motion control systems, galvanometers, and servo motors. It also provides special laser marking equipment, laser welding equipment, laser drilling equipment, waterproof and airtight testing equipment, CNC machine tools, laser direct imaging equipment, molding equipment, and testing equipment; and processing equipment and automated production lines for slurrying, stirring, coating, rolling, die-cutting, slitting, winding/stacking, battery cell assembly, baking, liquid injection, and chemical component preparation. In addition, the company offers laser boron doping, plasma enhanced vapor deposition, and low-pressure chemical vapor deposition equipment; diffusion, oxidation, and annealing furnaces; non-destructive dicing and dicing-welding machines; front-end wafer cutting equipment, including laser surface cutting, full cutting equipment, laser internal modification cutting equipment, and knife wheel cutting equipment; back-end packaging and testing equipment, such as wire bonding, crystal bonding, test tape, and wafer automation transmission equipment; and laser generators, robots, and 3D printers. Its products are used in electronic and semiconductor, mechanical hardware, new energy, packaging industry, brittle material industry, auto industry, sheet metal, and other applications. The company also provides equipment installation and after-sales services. The company was formerly known as Han's Laser Technology Co., Ltd. and changed its name to Han's Laser Technology Industry Group Co., Ltd. in November 2014. Han's Laser Technology Industry Group Co., Ltd. was founded in 1996 and is headquartered in Shenzhen, China.
Address:Han's Laser Technology Centre, Shenzhen, China, 518057
Website:https://www.hanslaser.com
ISIN:CNE000001JQ1

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FUNDAMENTALS

Trailing P/E:97.24 
Forward P/E:26.70 
PEG Ratio:0.86 
Price to Sales:6.40 
Price to Book:6.49 
Profit Margin:0.07 
Operating Margin:0.13 
Return on Assets:0.03 
Return on Equity:0.07 
DivYield:0.01 
Div/Share:0.35 
Revenue:20.95B 
EBITDA:2.189B 
Shares:1.03B 
Market Cap:98.749B 

TECHNICAL INDICATORS

MA5:94.781.2%
MA10:90.675.8%
MA20:97.922.1%
MA50:118.5723.6%
MA100:108.3813.0%
MA200:77.2424.2%
STO9:73.80
STO14:51.27
RSI14:45.80
WPR14:-38.98
MTM14:-9.02
ROC14:-0.09 
ATR:7.74 
Week High:101.135.4%
Week Low:80.3219.4%
Month High:140.6846.7%
Month Low:80.3224.2%
Year High:168.0875.2%
Year Low:31.92200.5%
Volatility:33.66 

RECENT SPLITS

Date Ratio
15 Jun 201115-10
25 Apr 20081-1
14 May 200715-10
25 May 200615-10
25 Nov 200513-10
01 Jun 200515-10

RECENT DIVIDENDS

Date Amount
21 May 2025$0.35
17 May 2024$0.20
18 May 2023$0.20
29 Apr 2022$0.40
13 May 2021$0.20
30 Jul 2020$0.20
30 May 2019$0.20
21 May 2018$0.20
06 Jun 2017$0.20
24 May 2016$0.20