EODData

SHE, 002008: Han'S Laser Tech A

21 Nov 2025
LAST:

34.90

CHANGE:
 1.79
OPEN:
35.98
HIGH:
36.49
ASK:
0.00
VOLUME:
21.39M
CHG(%):
4.88
PREV:
36.69
LOW:
34.87
BID:
0.00
 

CHART

RECENT END OF DAY PRICES

DateOpenHighLowCloseVolume
21 Nov 2535.9836.4934.8734.9021.39M
20 Nov 2537.6637.8536.5336.6913.35M
19 Nov 2537.3837.6836.6836.8915.31M
18 Nov 2537.9638.1537.0637.3716.26M
17 Nov 2537.9138.5637.7738.1214.06M
14 Nov 2538.8939.0638.0038.0019.41M
13 Nov 2538.6939.5638.5839.4419.19M
12 Nov 2538.8039.3638.5039.0418.51M
11 Nov 2539.7540.2938.4338.9421.92M
10 Nov 2540.0640.5438.9639.5023.68M

PROFILE

Name:Han'S Laser Tech A
About:Han's Laser Technology Industry Group Co., Ltd., together with its subsidiaries, researches, develops, produces, and sells laser processing equipment in China and internationally. The company offers ultraviolet and ultrafast lasers, high power fiber lasers, medium and low-power CO2 lasers, and pulsed fiber lasers, as well as general motion control systems, galvanometers, and servo motors. It also provides special laser marking equipment, laser welding equipment, laser drilling equipment, waterproof and airtight testing equipment, CNC machine tools, laser direct imaging equipment, molding equipment, and testing equipment; and processing equipment and automated production lines for slurrying, stirring, coating, rolling, die-cutting, slitting, winding/stacking, battery cell assembly, baking, liquid injection, and chemical component preparation. In addition, the company offers laser boron doping, plasma enhanced vapor deposition, and low-pressure chemical vapor deposition equipment; diffusion, oxidation, and annealing furnaces; non-destructive dicing and dicing-welding machines; front-end wafer cutting equipment, including laser surface cutting, full cutting equipment, laser internal modification cutting equipment, and knife wheel cutting equipment; back-end packaging and testing equipment, such as wire bonding, crystal bonding, test tape, and wafer automation transmission equipment; and laser generators, robots, and 3D printers. Its products are used in electronic and semiconductor, mechanical hardware, new energy, packaging industry, brittle material industry, auto industry, sheet metal, and other applications. The company also provides equipment installation and after-sales services. The company was formerly known as Han's Laser Technology Co., Ltd. and changed its name to Han's Laser Technology Industry Group Co., Ltd. in November 2014. Han's Laser Technology Industry Group Co., Ltd. was founded in 1996 and is headquartered in Shenzhen, China.
Address:Han's Laser Technology Centre, Shenzhen, China, 518057
Website:https://www.hanslaser.com
ISIN:CNE000001JQ1

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FUNDAMENTALS

Trailing P/E:37.33 
Forward P/E:36.34 
PEG Ratio:36.34 
Price to Sales:2.44 
Price to Book:2.49 
Profit Margin:0.07 
Operating Margin:0.12 
Return on Assets:0.01 
Return on Equity:0.07 
DivYield:0.01 
Div/Share:0.35 
Revenue:17.355B 
EBITDA:1.306B 
Shares:1.03B 
Market Cap:35.933B 

TECHNICAL INDICATORS

MA5:36.795.4%
MA10:37.898.6%
MA20:39.8514.2%
MA50:39.1612.2%
MA100:34.152.2%
MA200:29.8916.8%
RSI14:12.32 
WPR14:-100.00 
MTM14:-6.16
ROC14:-0.15 
ATR:1.29 
Week High:39.0611.9%
Week Low:34.870.1%
Month High:44.0526.2%
Month Low:34.8716.8%
Year High:47.6236.4%
Year Low:21.5162.3%
Volatility:45.49 

RECENT SPLITS

Date Ratio
15 Jun 201115-10
25 Apr 20081-1
14 May 200715-10
25 May 200615-10
25 Nov 200513-10
01 Jun 200515-10

RECENT DIVIDENDS

Date Amount
21 May 2025$0.35
17 May 2024$0.20
18 May 2023$0.20
29 Apr 2022$0.40
13 May 2021$0.20
30 Jul 2020$0.20
30 May 2019$0.20
21 May 2018$0.20
06 Jun 2017$0.20
24 May 2016$0.20